Advantech’s MIC-5332 is a dual processor ATCA blade based on the Intel next generation platform. It enables the highest performance available in ATCA form factor with up to 16 cores and 32 threads of processing power, fast PCI Express gen. 3 lanes running at up to 8Gbps, and best in class virtualization support. Two QPI interfaces between the CPUs improve memory and I/O access throughput and latencies when one processor needs to access resources hosted by the other socket. With four DDR3 DIMMs per socket in a quad channel design running up to 1600MT/s, the MIC-5332 not only offers superior memory bandwidth over 3-channel designs, but can also support memory densities up 256GB using latest LR DIMM technology. It outperforms previous generation dual socket designs while keeping similar thermal characteristics with balanced airflow resistance.

Using Intel’s latest PCH with its integrated 4-port SAS controller, the need for an external storage controller is eliminated making the MIC-5332 an ideal choice for cost sensitive control plane applications. While supporting two XAUI interfaces in the base model, support for dual dual star fabric implementations can be added by installing the FMM-5001B Fabric Mezzanine Module (FMM). Beyond that, the Fabric Mezzanine Module type II socket with PCIe x16 connectivity provides extension possibilities for additional front port I/O, offload and acceleration controllers such as Intel QuickAssist™ accelerators, IPSec offload engines or customer specific logic. FMMs do not only have higher PCI Express bandwidth than AMCs, but also do integrate well in terms of thermal design and board real estate when compared to Advanced Mezzanine Cards. Moreover, FMMs can be reused on RTMs and across different blade designs. This unmatched flexibility combined with the highest performance Intel Xeons available make the MIC-5332 equally well suited for application and data plane workloads.

Please refer to :
Related whitepaper-1: Fabric Mezzanine Modules Push IA Blade to 160Gbps on ATCA
Related whitepaper-2: Fabric Mezzanine Modules bring unprecedented I/O and acceleration flexibility to Intel® Xeon® ATCA Blades